Lid for an electrical hardware component

ABSTRACT

To minimize the warpage of an organic substrate that supports at least one electrical hardware component (e.g., a system-in-package module), a bottom surface of a lid is attached to a top surface of the electrical hardware component. The lid includes a leg that extends from the bottom surface of the lid towards a top surface of the substrate. A portion of the leg closest to the substrate may move relative to the substrate. As the lid warps, the lid does not also cause distortion of the substrate. The leg may be a flange that extends at least a portion of the width or at least a portion of the length of the lid, may be a post located at the perimeter of the lid, or may be any other portion extending from above the electrical component towards the substrate.

FIELD

The present embodiments relate to a lid for an electrical hardwarecomponent.

BACKGROUND

In a system-in-package module or something similar, a number ofintegrated circuits may be included in a single module to provide acomplete functional unit that uses few external components. An exampleof such a system-in-package module may include a combination ofspecialized processors, DRAM, flash memory, resistors and capacitorsmounted or embedded to a single substrate. Organic substrates, which aremade of a polymeric material and may be cheaper, thinner and lighterthan ceramic substrates, may be used.

A system-in-package module may also include at least one lid. The lidprovides thermal cooling for at least some of the electrical hardwarecomponents. The lid is attached to the organic substrate to also providemechanical support for the module during shipping and handling,protecting the module from external loading and reducing the warpage ofthe substrate.

BRIEF DESCRIPTION OF THE DRAWINGS

FIG. 1 illustrates a top view of one embodiment of a system-in-packagemodule;

FIG. 2 illustrates a top view of one embodiment of the system-in-packagemodule of FIG. 1 with one lid removed;

FIG. 3 illustrates a cross-section view of one embodiment of thesystem-in-package module of FIG. 1;

FIG. 4 illustrates a top view of one embodiment of a lid for thesystem-in-package module of FIG. 1;

FIG. 5 illustrates a front view of one embodiment of the lid of FIG. 4;

FIG. 6 illustrates a side view of one embodiment of the lid of FIG. 4;and

FIG. 7 illustrates a flow chart of minimizing the warpage of oneembodiment of the system-in-package module of FIG. 1.

DETAILED DESCRIPTION OF THE DRAWINGS Overview

To minimize the warpage of an organic substrate that supports at leastone electrical hardware component (e.g., a system-in-package module), abottom surface of a lid is attached to a top surface of the electricalhardware component. The lid includes a leg that extends from the bottomsurface of the lid towards a top surface of the substrate. Duringmanufacturing, reflow soldering may be used to mount the electrichardware component to the substrate and mount the substrate (e.g., thesystem-in-package module) to a printed circuit board. The heat appliedto the system-in-package module during reflow soldering may cause thelid to warp and therefore, cause the substrate to warp. In oneembodiment to minimize the warpage of the substrate and minimize thenumber of resultant solder joint failures between the substrate and theprinted circuit board, the lid is decoupled from the substrate. As thelid warps, the lid does not also cause distortion of the substrate. Aportion of the leg closest to the substrate may move relative to thesubstrate. The leg may be a flange that extends at least a portion ofthe width or at least a portion of the length of the lid, may be a postlocated at the perimeter of the lid, or may be any other portionextending from above the electrical component towards the substrate.

In one embodiment, an apparatus includes an organic substrate includinga top surface, and an electrical hardware component including a topsurface and a bottom surface that is attached to the top surface of thesubstrate. The apparatus also includes a lid that includes a leg and abottom surface that is attached to the top surface of the electricalhardware component. The leg extends from the bottom surface of the lidtowards the top surface of the substrate and has a portion closest tothe substrate. The portion of the leg closest to the substrate isoperable to move with respect to the substrate, either in contact or notin contact with the substrate.

In another embodiment, an apparatus includes a system-in-package module.The system-in-package module includes an organic substrate including atop surface, a memory including a top surface and a bottom surface thatis attached to the top surface of the substrate, and a semiconductorchip including a top surface and a bottom surface that is attached tothe top surface of the substrate. The system-in-package module alsoincludes a lid including a leg and a bottom surface that is attached toat least the top surface of the memory. The leg extends from the bottomsurface of the lid towards the top surface of the substrate, and aportion of the leg is in contact with the substrate. The portion of theleg in contact with the substrate is operable to move with respect tothe substrate.

In yet another embodiment, a method includes attaching a bottom surfaceof a cover above an electrical hardware component supported on anorganic substrate, the cover including an extension extending towards atop surface of the substrate on at least one side of the electricalhardware component. The method also includes applying heat or force tothe cover such that the shape of the cover changes, where the extensionis operable to move relative to the substrate when the shape of the lidchanges.

Example Embodiments

FIGS. 1 and 2 illustrate a top view of one embodiment of asystem-in-package module 100. The system-in-package module 100 includesa first assembly 102, a second assembly 104 and a third assembly 106.The system-in-package module 100 also includes a substrate 108 thatsupports each of the three assemblies 102, 104 and 106. Only one, two ormore than three assemblies 102, 104, and 106 may be provided. Thesubstrate 108 is an organic substrate 108 (i.e., the substrate is madefrom a polymeric material) such as, for example, a BismaleimideTriazine-based (BT-based) substrate 108. Other substrates, such as, forexample, direct bonded copper substrates, insulated metal substrates andceramic substrates, may be used for the substrate 108. The substrate 108of the system-in-package module 100 is attached to a printed circuitboard (PCB) 110.

Each of the three assemblies 102, 104 and 106 includes a lid 112, 114and 116, respectively. FIG. 2 illustrates a top view of one embodimentof the system-in-package module 100 with one lid 112 removed. As shownin FIG. 2, the first assembly 102 includes four memories 200 (e.g.,DRAM). The second assembly 104 also includes four memories 200 (notshown in FIG. 2). Other arrangements and numbers of memories 200 may beprovided for the system-in-package module 100. In other embodiments, thesystem-in-package module 100 and thus each of the three assemblies 102,104 and 106 may include any number of different, additional, fewer, orother electrical hardware components such as, for example, specializedprocessors (e.g., application specific integrated circuits (ASICs)),generalized processors, flash memory, resistors and capacitors. Thesystem-in-package module 100 may be used in any application, such as aRAM intensive application including, for example, in cell phones, gameconsoles, servers, switches and other networking equipment.

FIG. 3 illustrates a cross-section view of one embodiment of thesystem-in-package module 100 or a different system-in-package module.The first assembly 102 includes one or more memories 200 (only one shownin FIG. 3), each memory 200 includes a top surface 300 and a bottomsurface 302, a layer of thermal adhesive 304 disposed on the top surface300 of each memory 200, and the lid 112. The bottom surface 302 of eachmemory 200 is attached to a top surface 306 of the substrate 108. Theattachment may have one or more intervening layers, such as solder orflip chip bonding material. The bottom surface 302 of each memory 200may be attached to the top surface 306 of the substrate 108 (e.g., viacontact pads of the substrate 108) in any number of ways including, forexample, with solder or a conductive adhesive.

Both the lid 112 and the lid 114 include a top surface 308, a bottomsurface 310 and at least two legs 312. The legs 312 extend from thebottom surface 310 or other portion of each of the lids 112 and 114 in adirection towards the top surface 306 of the substrate 108 and on a sideof the memories 200 or other electrical component. The bottom surface310 of each lid 112 and 114 is attached to the top surface 300 of eachmemory 200, with the layer of thermal adhesive 304 disposed on the topsurface 300 of each memory 200. The thermal adhesive 304 may be anynumber of adhesives including, for example, a two-part epoxy resin(e.g., silver-based). Other thermal compounds such as, for example,silicone thermal compounds or metal thermal compounds, may be usedinstead of or in addition to the thermal adhesive 304. Other interveninglayers may be provided, such as associated with a stack of electricalcomponents, a thermal conduction layer, or other part. In otherembodiments, the bottom surface 310 of the lid is spaced from theelectrical component, such as by a gap, air, or other material.

The third assembly 106 includes at least one ASIC 314 (e.g., asemiconductor chip 314). The ASIC 314 has a top surface 316 and a bottomsurface 318. The third assembly also includes the lid 116 and a layer ofthermal grease 320 disposed on the top surface 316 of the ASIC 314and/or a bottom surface 324 the lid 116. The third assembly 106 mayalternatively or additionally include other components. The bottomsurface 318 of the ASIC 314 is attached directly or indirectly to thetop surface 306 of the substrate 108. The bottom surface 318 of the ASIC314 may be attached to the top surface 306 of the substrate 108 (e.g.,via contact pads of the substrate 108) in any number of ways including,for example, with solder or conductive adhesive. The ASIC 314 may alsobe wire or flip chip bonded to the top surface 306 of the substrate 108.

In one embodiment, the ASIC 314 may be a flip chip. Attachment pads (notshown in FIG. 3) of the semiconductor chip 314 are metalized, and solderis deposited on each of the metalized pads. The semiconductor chip 314is inverted, such that the bottom surface 318 shown in FIG. 3 is the topsurface of the semiconductor chip 314. The metalized pads are brought incontact with contact pads of the substrate 108, and the solder depositedon each of the metalized pads is melted using reflow soldering, forexample. An electrically-insulating adhesive may be underfilled tostrengthen the bond between the semiconductor chip 314 and the topsurface of the substrate 108.

The lid 116 includes a top surface 322, the bottom surface 324 and atleast two legs 326. The legs 326 extend from the bottom surface 324 orother portion of the lid 116 in a direction towards the top surface 306of the substrate 108 and on a side of the ASIC 314 or other electricalcomponent. The bottom surface 324 of the lid 116 is attached to the topsurface 316 of the ASIC 314, with the layer of thermal grease 320disposed on the top surface 316 of the ASIC 314. The thermal grease 320may be any number of thermal greases including, for example, asilver-based thermal grease or a carbon-based thermal grease. Otherthermal compounds such as, for example, a silver-based two-part epoxyresin may be used instead of or in addition to the thermal grease 320.The top surface 322 and the bottom surface 324 may be flat, curved,rough or have other texture or shape.

The two legs 326 each include an end 328 that is closest to the topsurface 306 of the substrate 108 (e.g., an end 328 that is proximate toor in contact with the top surface 306 of the substrate 108). The end328 is a point, line, or area, such as a bottom area along a planarsurface or flange extending from above the top surface 316 of thecomponent to closer to the top surface 306 of the substrate 108. The end328 of each of the two legs 326 is attached to the top surface 306 ofthe substrate 108 with a layer of adhesive 330 that is disposed on theend 328 of each of the two legs 326, between the ends 328 and the toplayer of the substrate 306. The layer of adhesive 330 may be any numberof adhesives including, for example, an epoxy adhesive. In alternativeembodiments, the end 328 is not attached, such as described below forthe other lids 112, 114.

The legs 312 of the lids 112 and 114 extend from the bottom surfaces 310or other portions of the lids 112 and 114 in a direction towards the topsurface 306 of the substrate 108, such that an end 332 closest to thetop surface 306 of the substrate 108 may be in contact with but notattached to the top surface 306 of the substrate 108 for each of thelegs 312. Therefore, the ends 332 of the legs 312 may move relative tothe top surface 306 of the substrate 108. Any number of ends 332 may beprovided for each lid 112, 114, such as one end in a rectangular shapearound the entire component or such as four ends, one on each side ofthe electrical component.

In one embodiment, the ends 332 of the legs 312 are not in contact withthe top surface 306 of the substrate 108 unless an external force isapplied to the top surface 308 of a lid 112, 114 or is applied to bendthe substrate 108. When an external force is applied to the top surface308 of the lid 112, the ends 332 of the legs 312 may bottom out on thetop surface 306 of the substrate 108, thus providing mechanical supportfor the system-in-package module 100 during shipping and handling andprotecting the system-in-package module 100 from external loading.

A bottom surface 334 of the substrate 108 may be attached to a topsurface 336 of the PCB 110. The bottom surface 334 of the substrate 108includes an array of solder balls 338 (e.g., a ball grid array (BGA)338) used to conduct electrical signals from the system-in-packagemodule 100 to the PCB 110. The BGA 338 is attached to correspondingcontact pads on the PCB 110 using, for example, reflow soldering. Duringreflow soldering, the system-in-package module 100 and the PCB 110 aresubjected to controlled heat, melting the solder of the BGA 338 andconnecting the corresponding pads or traces between the memory 200 andthe substrate 108, the ASIC 314 and the substrate 108, and between thesubstrate 108 and the PCB 110. Controlled heating may be accomplished bypassing the system-in-package module 100 and the PCB 110 through areflow oven or an infrared lamp, or soldering each joint individually,for example. Other arrangements of conductive materials such as, forexample, an array of conductive pins may be provided on the bottomsurface 334 of the substrate 108 to conduct electrical signals from thesystem-in-package module 100 to the PCB 110.

In one embodiment, the lids 112, 114 and 116 are made of AluminumSilicon Carbide and are manufactured using a molding process. Due to themolding process, the material of the lids 112, 114 and 116 may not beuniform, and therefore, the lids 112, 114 and 116 may warp whensubjected to heat. Other materials such as, for example, copper andnickel may be used for the lids 112, 114 and 116.

Since the legs 312 of the lids 112 and 114 are not attached to the topsurface 306 of the substrate 108, the ends 332 of the legs 312 may moverelative to the top surface 306 of the substrate 108 if the lids 112,114 warp. Therefore, the warpage of the lids 112 and 114 does not impartan upward force on the substrate 108, which may otherwise cause solderjoint failures between the substrate 108 and the PCB 110. Spacing theends 332 of the legs 312 away from the substrate 108 may further preventstraining the substrate 108 due to warpage of the lids 112, 114.

In one embodiment, the bottom surface 324 of the lid 116 is attached tothe ASIC 314 with a layer of thermal adhesive 304. The legs 326 of thelid 116 extend in a direction towards the top surface 306 of thesubstrate 108, such that the ends 328 of the legs 326 are in contactwith but not attached to the top surface 306 of the substrate 108.

In another embodiment, a bottom surface of a single lid is attached tothe top surface 300 of each of the memories 200 and the top surface 316of the ASIC 314 with layers of thermal adhesive 304. The single lidincludes at least two legs or one surrounding leg that extend from thebottom surface of the single lid in a direction towards the top surface306 of the substrate 108, such that an end of each leg closest to thetop surface 306 of the substrate 108 is in contact with but not attachedto the top surface 306 of the substrate 108. System-in-package modules100 with additional numbers of lids may be provided. Different portionsof a leg or different legs of a same lid may be connected to thesubstrate 108, such as connecting one point or side of the lid to thesubstrate 108, but with the remainder of the lid or legs unconnected.

FIG. 4 illustrates a top view of one embodiment of a lid 400 for thesystem-in-package module 100, a different system-in-package module, or adifferent configuration of electrical hardware components. The lid 400includes a front 402, a back 404, a first side 406, and a second side408. The lid 400 may be any number of shapes including, for example,rectangular. The size and shape of the arrangement of electricalhardware components that the lid covers may determine the size and shapeof the lid 400. The lid 400 may be any number of materials including,for example, Alumina Silicon Carbide, copper or nickel.

FIG. 5 illustrates a front view of one embodiment of the lid 400 or adifferent lid. The lid 400 includes a bottom surface 500. A first leg502 and a second leg 504 extend away from the bottom surface 500 of thelid 400 in a direction perpendicular to the bottom surface 500 of thelid 400. The first leg 502 and the second leg 504 are posts, each with arectangular cross-section taken in a direction parallel to the bottomsurface 500 of the lid 400. The first leg 502 is located at a firstcorner of the lid 400, at the intersection of the front 402 and thefirst side 406. The second leg 504 is located at a second corner of thelid 400, at the intersection of the front 402 and the second side 408.

The lid 400 also includes a third leg 506 that runs at least a portionof the width of the lid 400 at the front 402. The third leg 506 is aflange that extends away from the bottom surface 500 of the lid 400 in adirection generally perpendicular to the bottom surface 500 of the lid400. “Generally” allows for incomplete bending or other angles whilestill extending from away from the substrate towards the substrate. Theheight of the third leg 506 is approximately equal to the height of thefirst leg 502 and the height of the second leg 504.

FIG. 6 illustrates a side view of one embodiment of the lid 400 or adifferent lid. The lid 400 includes a fourth leg 600 and a fifth leg(not shown in FIG. 6) that extend away from the bottom surface 500 ofthe lid 400 in a direction perpendicular to the bottom surface 500 ofthe lid 400. The fourth leg 600 and the fifth leg are posts, each with arectangular cross-section taken in a direction parallel to the bottomsurface 500 of the lid 400. The fourth leg 502 is located at a thirdcorner of the lid 400, at the intersection of the back 404 and the firstside 406. The fifth leg is located at a fourth corner of the lid 400, atthe intersection of the back 404 and the second side 408.

The lid 400 also includes a sixth leg (not shown in FIG. 6) that runs atleast a portion of the width of the lid 400 at the back 402. The sixthleg is a flange that extends away from the bottom surface 500 of the lid400 in a direction perpendicular to the bottom surface 500 of the lid400. The size of the sixth leg is the same as the size of the third leg506. Also, the position of the sixth leg relative to the fourth leg 600and the fifth leg is the same as the position of the third leg 506relative to the first leg 502 and the second leg 504. The height of thesixth leg is approximately equal to the height of the fourth leg 600 andthe height of the fifth leg. In one embodiment, the heights of the firstleg 502, second leg 504, third leg 506, fourth leg 600, fifth leg andsixth leg are all approximately equal. The cross-section of any of thelegs may vary along the length of the leg. In one embodiment, the legsextend away from the bottom surface 500 of the lid 400 in a directionthat is at an acute or obtuse angle to the bottom surface 500 of the lid400. The legs may also be located interior to the perimeter of thebottom surface 500 of the lid 400 or may connect to the top surface ofthe lid 400.

In one embodiment, the lid 400 includes four posts, one post beinglocated at each of the four corners of the lid 400. In anotherembodiment, the lid 400 includes a single post located at one of thefour corners of the lid 400. In yet another embodiment, the lid 400 doesnot include any legs that extend from the lid 400. In other embodiments,one or more legs extend from the sides but not the corners of the lid400. Other arrangements of flanges, posts, and other extensions may beprovided for the lid 400.

FIG. 7 illustrates a flow chart of minimizing the warpage of thesystem-in-package module 100 of FIGS. 1 and 2 or a different module. Themethod is implemented in the order shown, but other orders may be used.Additional, different, or fewer acts may be provided.

At block 700, a lid is attached to or above an electrical hardwarecomponent that is supported on an organic substrate. A top surface ofthe electrical hardware component is attached to a bottom surface of thelid with a layer of thermal compound or positioned under the lid. Thethermal compound may be a thermal adhesive or a thermal grease. The lidincludes a leg that extends from the bottom surface of the lid towards atop surface of the substrate. The leg may be a post, a flange or otherextension from the bottom surface of the lid. The lid may include morethan one leg or no legs at all. The leg is located at the perimeter orinterior to the perimeter of the bottom surface of the lid.

At block 702, heat or a force is applied to the lid, such that the shapeof the lid changes. A bottom surface of the electrical hardwarecomponent may be attached to contact pads of a top surface of thesubstrate using reflow soldering. During reflow soldering, thesubstrate, the electrical hardware component and the lid are allsubjected to controlled heat to melt the solder and attach the bottomsurface of the electrical hardware component to the top surface of thesubstrate. The lid may be made of Aluminum Silicon Carbide and may bemanufactured using a molding process. The lid may also be made of othermaterials, such as copper or nickel. The material of the lid may benon-uniform. When the lid is subjected to the heat during reflowsoldering, the lid may warp. The lid may also warp if an external forceis applied to the lid.

At block 704, the leg of the lid is moved relative to the substrate whenthe shape of the lid changes. The leg is in contact with the top surfaceof the substrate but is not coupled to the top surface of the substrateor is not in contact with the substrate. In one embodiment, the leg mayonly be in contact with the top surface of the substrate when anexternal force is applied to the lid. By not fixing the leg relative tothe substrate, any deformation of the lid may not strain the substrate.The leg may lend stability to the substrate by contacting the substrateif the substrate is bent.

Various embodiments described herein can be used alone or in combinationwith one another. The foregoing detailed description has described onlya few of the many possible implementations of the present invention. Forthis reason, this detailed description is intended by way ofillustration, and not by way of limitation.

1. An apparatus comprising: an organic substrate comprising a topsurface; an electrical hardware component comprising a top surface and abottom surface, the bottom surface being attached to the top surface ofthe substrate; and a lid comprising a leg and a bottom surface, thebottom surface being above the top surface of the electrical hardwarecomponent, wherein the leg extends from above the top surface of theelectrical hardware component towards the top surface of the substrateand has a portion closest to the substrate, and wherein the portion ofthe leg closest to the substrate is operable to move relative to thesubstrate.
 2. The apparatus of claim 1, wherein the bottom surface ofthe lid is attached to the top surface of the electrical hardwarecomponent with a layer of thermal adhesive.
 3. The apparatus of claim 1,wherein the lid is made of Aluminum Silicon Carbide.
 4. The apparatus ofclaim 1, wherein the lid further comprises a second leg extending fromthe bottom surface of the lid towards the top surface of the substrateand having a portion closest to the substrate, and wherein the portionof the second leg closest to the substrate is operable to move withrespect to the substrate.
 5. The apparatus of claim 4, wherein the lidfurther comprises a front and a back, and wherein the leg is a flangethat runs at least a portion of the width of the lid at the front, andthe second leg is a flange that runs at least a portion of the width ofthe lid at the back.
 6. The apparatus of claim 5, wherein the lidfurther comprises a third leg, a fourth leg, a fifth leg and a sixthleg, the third, fourth, fifth and sixth legs each extending from thebottom surface of the lid towards the top surface of the substrate andeach having a portion closest to the substrate, and wherein the portionsof the third, fourth, fifth and sixth legs closest to the substrate areoperable to move with respect to the substrate.
 7. The apparatus ofclaim 6, wherein the lid further comprises a first side and a secondside, and wherein the third leg is a post located at a corner of thefirst side and the front, the fourth leg is a post located at a cornerof the second side and the front, the fifth leg is a post located at acorner of the first side and the back, and the sixth leg is a postlocated at the second side and the back.
 8. The apparatus of claim 1,wherein the lid comprises a plurality of legs, each of the plurality oflegs being a post that extends from the bottom surface of the lid to thetop surface of the substrate and having a portion closest to thesubstrate, and wherein the portion of each of the plurality of legsclosest to the substrate is operable to move with respect to thesubstrate.
 9. The apparatus of claim 8, wherein each of the plurality ofposts is located at the perimeter of the lid.
 10. An apparatuscomprising: a system-in-package module comprising: a substratecomprising a top surface; a memory comprising a top surface and a bottomsurface, the bottom surface being attached to the top surface of thesubstrate; a semiconductor chip comprising a top surface and a bottomsurface, the bottom surface attached to the top surface of thesubstrate; and a lid comprising a leg and a bottom surface that isattached to at least the top surface of the memory, wherein the legextends from the bottom surface of the lid towards the top surface ofthe substrate, and a portion of the leg is in contact with thesubstrate, and wherein the portion of the leg in contact with thesubstrate is free of connection with the substrate.
 11. The apparatus ofclaim 10, wherein the bottom surface of the lid is attached to the topsurface of the semiconductor chip.
 12. The apparatus of claim 11,wherein the top surface of the memory and the top surface of thesemiconductor chip are each attached to the bottom surface of the lidwith a layer of thermal adhesive.
 13. The apparatus of claim 10, whereinthe system-in-package module further comprises: a second lid comprisinga bottom surface and a leg, the bottom surface of the second lid beingsupported on the top surface of the semiconductor chip, and wherein theleg of the second lid extends from the bottom surface of the second lidtowards the top surface of the substrate and is attached to the topsurface of the substrate.
 14. The apparatus of claim 13, wherein the lidand the second lid are both made of Aluminum Silicon Carbide.
 15. Theapparatus of claim 13, wherein the system-in-package module furthercomprises a layer of thermal grease disposed on the top surface of thesemiconductor chip.
 16. The apparatus of claim 15, wherein the bottomsurface of the lid is attached to the top surface of the memory with alayer of thermal adhesive.
 17. A method comprising: attaching a coverabove a top surface of an electrical hardware component supported on anorganic substrate, the cover comprising an extension extending towards atop surface of the substrate on at least one side of the electricalhardware component; applying heat or a force to the cover, such that theshape of the cover changes, wherein the extension is operable to moverelative to the substrate when the shape of the cover changes.
 18. Themethod of claim 17 further comprising: applying a force to a top surfaceof the cover; and moving the extension in a direction towards the topsurface of the organic substrate, such that a portion of the extensionclosest to the substrate contacts the top surface of the substrate. 19.The method of claim 17, wherein the cover is made of Aluminum SiliconCarbide.
 20. The method of claim 17, wherein attaching the bottomsurface of the cover to the top surface of the electrical hardwarecomponent comprises applying a layer of thermal adhesive to the topsurface of the electrical hardware component.